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货号 产品名称 产品简介 规格 应用 品牌
25075-100 HALOCARBON 700 OIL HALOCARBON 700 润滑油
Inert, non-flammable lubricating oil. Polymer is a blend of oligomers. Also used as an inert medium in transgenic studies of fruit fly Drosophilia embryos
100 ml 化学品 Polysciences
25074-50 HALOCARBON 400 OIL HALOCARBON 400 润滑油
Inert, non-flammable lubricating oil. Polymer is a blend of oligomers. Also used as an inert medium in transgenic studies of fruit fly Drosophilia embryos
50 ml 化学品 Polysciences
25074-100 HALOCARBON 400 OIL HALOCARBON 400 润滑油
Inert, non-flammable lubricating oil. Polymer is a blend of oligomers. Also used as an inert medium in transgenic studies of fruit fly Drosophilia embryos
100 ml 化学品 Polysciences
25073-50 HALOCARBON 200 OIL HALOCARBON 200 润滑油
Inert, non-flammable lubricating oil. Polymer is a blend of oligomers. Also used as an inert medium in transgenic studies of fruit fly Drosophilia embryos
50 ml 化学品 Polysciences
25073-100 HALOCARBON 200 OIL HALOCARBON 200 润滑油
Inert, non-flammable lubricating oil. Polymer is a blend of oligomers. Also used as an inert medium in transgenic studies of fruit fly Drosophilia embryos
100 ml 化学品 Polysciences
25076-50 HALOCARBON 1000N OIL HALOCARBON 1000N 润滑油
Inert, non-flammable lubricating oil. Inert, non-flammable lubricating oil. Polymer is a blend of oligomers
50 ml 化学品 Polysciences
25076-100 HALOCARBON 1000N OIL HALOCARBON 1000N 润滑油
Inert, non-flammable lubricating oil. Inert, non-flammable lubricating oil. Polymer is a blend of oligomers
100 ml 化学品 Polysciences
24807-50 CROSSLINKED POLY(N-VINYL ACETAMIDE) 交联聚(N-乙烯基乙酰胺)
This crosslinked version of poly(N-vinyl acetamide) is also supplied for applications where increased stability is required. It has useful applications as a thickener in rheology control.
50 g 化学品 Polysciences
15629-250 Amberlite®IRA-458 ACRYLIC-DVB Amberlite®IRA-458 ACRYLIC-DVB阳离子树脂
污水处理
250 g 化学品 Polysciences
15621-250 Amberlite® IRA-958 ACRYLIC-DVB Amberlite® IRA-958 ACRYLIC-DVB阴离子树脂
去色,去有机物及氰化物
250 g 化学品 Polysciences
15622-250 Amberlite® IRA-93 STYRENE-DVB Amberlite® IRA-93 STYRENE-DVB阴离子树脂
去色,除银离子及氰化物
250 g 化学品 Polysciences
15626-250 Amberlite® IR-122 Amberlite® IR-122阳离子树脂
污水处理
250 g 化学品 Polysciences
04698-250 Amberlite® IR-120 Plus Amberlite® IR-120 Plus阳离子树脂
分离稀土
250 g 化学品 Polysciences
04714-250 Amberlite® IR-120 Amberlite® IR-120阳离子树脂
分离稀土
250 g 化学品 Polysciences
15617-250 Amberlite® 200 STYRENE-DVB Amberlite® 200 STYRENE-DVB阳离子树脂
分离稀土
250 g 化学品 Polysciences
19522-250 AMBERLITE IRA 900 16-50 MESH Amberlite® IRA-900阴离子树脂
用于去离子及有机物
250 g 化学品 Polysciences
WL4000-25A WL4000 Wafer Level Coating 晶片粘合剂
poxy based negative photoresist coating suited for applications at the wafer level. Rapidly curable by UV light, good adhesive properties, high heat resistance, & durable. Applied by brush, dip, spin coat, or spray methods.
100 ml 半导体封装 Polysciences
UC5001-10 UC5001 EasyFILL™ UC5001 EasyFILL™密封剂
Rapid curing capillary flow underfill with low stress cure, high durability, high Tg, & low CTE. Thermally curable
10 ml 半导体封装 Polysciences
SF860-1 SF860 A&B OptiCLEAR™ Liquid Encapsulant Fill SF860 A&B OptiCLEAR™环氧树脂密封剂
2 component epoxy designed for bonding, encapsulating, & sealing applications requiring low color, good clarity, & high Tg. Cures rapidly at elevated temperature
1 kit (1 kg) 半导体封装 Polysciences
SF50-3 SF50 LoSTRESS™ Liquid Encapsulant SF50 LoSTRESS™半导体密封剂
Liquid encapsulant fill material specifically designed to offer efficient light transmission & low cure stress. 100% solids, unfilled, liquid encapsulant designed for encapsulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organic. UV or thermally curable
3 ml 半导体封装 Polysciences
SF5021-10 SF5021 OptiCLEAR™ Liquid Encapsulant Fill SF5021 OptiCLEAR™半导体密封剂
Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor devices requiring high toughness & strong adhesion to various substrates such as metal, ceramic, & organice. UV or thermally curable
10 ml 半导体封装 Polysciences
PC200K-1 POTTING COMPOUND KIT PC200环氧树脂粘合剂
A versatile, 2 part, fire resistant, room temperature curable epoxy. Useful as an adhesive, encapsulant or potting compound
1 kit (1 kg) 半导体封装 Polysciences
PC1201K-1 EPOXY ENCAPSULANT KIT PC1200环氧树脂粘合剂
2 component epoxy encapsulant for applications requiring high thermal conductivity, heat resistance, rigidity, & dimensional stability. Excellent adhesion to many substrates including metals, themosetting plastics, & ceramics, good durability, high modulus, low CTE, & thermally curable
1 kit (1 kg) 半导体封装 Polysciences
HV331K-2 SILICONE ENCAPSULANT KIT 硅密封剂
2 component, low viscosity silicone encapsulant suitable for encapsulation applications including sesnsitive optoelectronic assemblies. Stress free & thermally curable
1 kit (1 kg) 半导体封装 Polysciences
HV330-1 SILICONE ENCAPSULANT KIT 硅密封剂
2 component, thermally conductive silicone encapsulant with a wide service temperature range of use, fire resistance, good environmental stability, & good cured flexibility. Rapid heat curable
1 kit (1 kg) 半导体封装 Polysciences
16752-0.5 MC BOND ACRYLIC CEMENT 聚丙烯酸,聚碳酸酯及PETG粘合剂
可以牢固粘合,粘合所需时间短,强度高
4x250ml 半导体封装 Polysciences
16146-5 POLY(STYRENESULFONYL FLUORIDE)
5 g Polysciences
21744-10 Poly(n-butyl acrylate/2-methacryloxyethyltrimethylammonium bromide) 80:20
疏水阳离子聚合物
10 g Polysciences
21477-10 Poly(n-butyl acrylate/2-methacryloxyethyltrimethylammonium bromide) 80:20
疏水阳离子聚合物
10 g Polysciences
24911-1 Poly(methyl methacrylate/methacrylic acid 5 amino fluoresceinamine)[~ 90:9:1% wgt]
荧光聚合物
1 g Polysciences
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